IoT Chip-to-Cloud Migration
Proven, zero-touch Chip-to-Cloud integration empowers IoT solutions builders & system integrators
Contact our experts to learn more about Chip-to-Cloud MigrationIoT providers and manufacturers are regularly faced with choosing between robust security and efficient device integration
You need a solution that prioritizes both.
Infineon, GlobalSign, Eurotech, and Microsoft Azure have collaborated to remove these barriers to IoT security. Together, this partnership has developed a secure, zero-touch IoT device provisioning to the cloud solution which operates at scale and reduces the risk of supply-chain compromise.
Through proven integrations along the IoT device chain of trust, adoption of the 802.1AR specification, and the unambiguous domain expertise of each company, we’ve made it possible for IoT security to be implemented from the very beginning of a device’s lifecycle. From the TPM chip that is manufactured into the device to the PKI-based identity at enrollment, provisioning to the cloud and operation in the field, we secure IoT devices from chip-to-cloud.
This solution works to help solution providers by introducing a simplified 3-step process:
- 1. Create a PKI account and receive an ICA certificate
- 2. Register the ICA to the cloud
- 3. Provide custom device configuration and receive a custom ordering code
This collaboration is a proven, interoperable solution that helps IoT operators and systems integrators accelerate time to market, eliminate integration challenges, reduce the need for multi-domain expertise in their development teams, and reduce operational expense to secure IoT devices at scale.
Contact Us to Learn More
By requesting a consultation, a GlobalSign Product Specialist will contact you.